Multilayer PCB Has Even more Than Two Conductive Copper Layers

Multilayer PCB has more than two conductive copper layers which mainly consist of inner layer cores, prepreg tiers and copper foils and they? re melted together through heat and stress. Lamination process is among the key to control good quality of multilayer PCB, this process requires specific heating system and pressure with regard to specific periods of time centered on materials used to ensure the PCB board is made properly.

The multilayer PCB is the development of typically the double sided PCB with increasing intricacy and density of components, they permitted the designers in order to produce highly complicated and compact circuits and further advancement of blind plus buried via gap technology has pushed these limits also further.

With the particular requirements of larger precision in several applications, the demands regarding multilayer PCB maintain increasing continuously in recent years. The typical applications of multilayer printed circuit boards include Computers, Data storage, Cell phone transmission, GPS technology, satellite tv systems and therefore on.

A-TECH will be an experienced multilayer PCB manufacturer which own complete multilayer PCB manufacturing procedure in house through inner layer, machine lamination to area finishes, it provides us more benefits in the opposition of global market shares for multilayer printed circuit planks on quality, price and lead period. The proportion of multilayer PCB all of us manufactured is more than 65%.

HDI PCB, the complete brand is Very dense Interconnect PCB, it needs very much higher wiring density with finer track and spacing, smaller sized vias and larger connection pad thickness. Blind and hidden vias? multilayer pcb design is one of their noticeable feature. HDI PCB are widely used for Cell phone, pill computer, digital camera, GPS NAVIGATION, LCD module plus other different region.

A-TECH CIRCUITS provides HDI PCB producing services to around the world customers in the particular top quality automotive business, medical camera market, mobile, computing plus defense industry.

Currently the advanced HDI technology we applied include: “Direct Laserlight Drill”(DLD) is going of copper level by direct LASER laser irradiation, compare to additional laser drilling with conformal mask, the copper primary laser drilling has the ability to of providing increased accuracy, better opening quality and far better efficiency for HDI projects. “Copper Filled” for special stack microvia, “Laser Primary Imaging”(LDI) is particularly designed for great line technology, to be able to eliminate dimensional balance problem of artwork caused by environment and material issues.

Leave a Reply

Your email address will not be published. Required fields are marked *